Epoxy Copper Paste

Features

  • - Epoxy-base copper paste
  • - Five-free (solvent-free, void-free, cleaning-free, corrosion-free, electrical short-free)
  • - Customized formulation (viscosity, curing temp, curing time, Tg, etc
  • - Filler metal type nano Cu powder, nano Ag-coated Cu powder
    • Products ECP-NCP ECP-ACC-Paste ECP-HB-180 ECP-HB-240 ECP-ACNC
    Metal commposition Nano Cu powder Ag-coated Cu powder Cu powder+ (Sn-Bi solder powder) Cu powder+ (Sn-Ag-Cu solder powder Ag-coated nano Cu powder
    Application PCB via filling PCB via filling, Die attach Die attach Die attach Die attach

    Ag-coated Cu Paste

  • - Filler content 70-80 wt%
  • - Proper electrical conductivity: 10^-3 - 10^-4 ohm.cm
  • - Low cost in comparison with the conventional Ag paste

    • Application Field

  • - Formation of conducting electrode and line
  • - PCB via filling, die attach
  • - Dispensing or printing