Solder Paste

- High Reliability High Reflow Temperature

The SP240 Series is a HIGH-temperature solder paste that can be applied to SMT process and obtain excellent results under high temperature reflow condition

Application

  • - It can be used in the semiconductor equipment industry that requires SMT and die attach process as well as in high-temperature operation environment
  • - Optimized for printing process

    • Features and Advantages

  • - It uses halogen-free flux
  • - Less change over time during continuous printing and has a very consistent printing performance
  • - Excellent heat resistance even in low-temperature reflow
  • - Excellent wetting performance and minimizes void
  • - High Soldering reliability because of its little slump phenomenon after printing
  • - Excellent recovery system with less occurence of solder ball

    •

    Product Information

  • Metal Alloy : Sn3.0Ag0.5Cu/ Sn0.7Cu, can be customized
  • Powder size : Type 4(20~38um), Type 5 (15~25um), Type 6 (5~15um)
  • Packing : 500g, can be changed according to customer request

    • Physical Properties

    Spec Unit Value
    Color - Gray
    Specific Gravity - 7.4
    Thixotropic Index (TI) - 0.4~0.7
    Viscosity @25C Pa.S LV(40~80) MV(80~140) HV(140~230)
    Thermal Conductivity W/mK 63
    SIR Ohm >1.0x10E9
    Reflow Condition - Refer to reflow profile