Epoxy Solder Paste

- High Reliability High Reflow Temperature

Introduction

With the simplification of manufacturing process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been increasingly considered as a competitive bonding material. The ESP material comprised solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With these advantages, ESP is becoming a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

The ESP240N Series is a HIGH-temperature epoxy solder paste with higher reliability than conventional solder paste. It is based on thermoset epoxy mixed with solder powder

Application

  • - LED COB or Flip chip LED soldering material
  • - Suitable for dotting, dispensing and Screen printing

    • Features and Advantages

  • - Reflow in low-oxygen or N2 atmosphere (<500 ppm O2)
  • - Very stable during continuous printing and has very consistent printing performance
  • - Excellent wetting performance and void minimization
  • - High reliability for soldering because of fewer resulting slump phenomena after printing
  • - Excellent recovery system with fewer occurrences of solder ball
  • - Efficient response to fine pitch
  • - Better bonding strength compared with a general solder paste
  • - SMT + Underfill process can be replaced with single SMT process

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    Product Information

  • Metal Alloy : Sn3.0Ag0.5Cu, Sn0.7Cu, can be customized
  • Powder size : Type 4(20~38um), Type 5 (15~25um), Type 6 (5~15um)
  • Packing : 500g, can be changed according to customer request

    • Physical Properties

    Spec Unit Value
    Color - Gray
    Specific Gravity - 7.4
    Thixotropic Index (TI) - 0.4~0.7
    Viscosity @25C Pa.S LV(40~80) MV(80~140) HV(140~230)
    Tg C 75
    Thermal Conductivity W/mK 63
    SIR Ohm >1.0x10E9
    Reflow Condition - Refer to reflow profile