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Products
Total Solution for Electronic Packaging & Assembly
Low Temp Epoxy Solder Paste
Achieving excellent soldering through SMT process (low temp reflow).
High Reliability Epoxy Solder Paste
Achieving Higher Reliability than conventional solder paste
Epoxy Flux Paste (with/without filler)
For mounting of BGA, CSP, PoP, IC driver on flip chip Assembly
Epoxy Copper Paste
Formation of conductive electrode and line, PCB via filling