Epoxy Flux Paste (without filler)

Application

  • - Reinforcement of bump edge by fillet formation after mounting of solder balls
  • - Stack chip package
  • - Package on package (Pop)
  • - Flip-chip semiconductor underfill
  • - BGA package underfill

    • Characteristics

  • - Reduces the existing flip-chip process and underfill process into a single process
  • - Increases productivity by reducing the number of process
  • - Fluxing effect the metal oxide film on package lead, solder ball, and Cu pad
  • - Solvent-free, cleaning-free,corrosion-free
  • - Customized formulation (viscosity, curing temp, Tg, etc)

    •

    Epoxy Flux Paste (with filler)

    Characteristics

  • - No-flow underfill material
  • - SiO2, filler content : 10-70 wt%
  • - SiO2, filler size: 0.2 - 4 um
  • - Customized formulation (viscosity, curing temp, curing time, Tg, etc)

    • Application Field

  • - Mounting of driver IC chips on film flip chip package
  • - Mounting of application processors on flip chip package
  • - Fine pitch I/O flip chip package